Elephantech Inc. was selected as one of the winners of Logitech’s Future Positive Challenge, a technology challenge for sustainability-led disruptors poised to make a meaningful contribution to a positive future.
Elephantech Inc. has raised approximately 900 million yen through a third-party allocation of new shares. With this third-party allotment, Elephantech has raised approximately 9 billion yen in total including equity, debt, and subsidies.
At Elephantech, we believe that it's our responsibility as a corporation to communicate our efforts in reducing our environmental impact. To make this easier to understand, we've worked on visualizing our sustainability initiatives.
Tokyo, Japan - Elephantech Inc. ("Elephantech") won the EcoBalance Award for the Best Business Practices at the 15th Biennial International Conference on EcoBalance held at Fukuoka Convention Center from October 30 to November 2.
Elephantech Inc., a developer of innovative manufacturing technologies that significantly reduce water, resources, and energy consumption of printed circuit boards, has raised 2.15 billion yen through a third-party allocation of new shares.
The most significant feature is that this sample uses electrolytic gold plating. What has changed significantly with the adoption of electrolytic gold plating is that the thickness of the gold plating is much thicker than that of electroless gold plating.
The Neochromato process jointly developed by Elephantech and NICCA CHEMICAL contributes significantly toward reducing the industry’s environmental impact
Elephantech Inc. is pleased to announce the appointment of Mr. Hiroshi Miyao from Mitsui Chemicals Inc. as the new director of its Additive Manufacturing Center (“AMC”). The new appointment took effect on April 1, 2022.
Elephantech Inc. is pleased to announce the joint development with NICCA CHEMICAL CO., LTD. of the “Neochromato process” polyester fabric discharge printing technology with the aim of achieving zero-waste in fashion textile.
We hope to accelerate the expansion of manufacturing possibilities to further expand the innovative additive manufacturing of inkjet technology and its social implementation.
we'll continue to expand the variety of metal ink types the company handles to promote further the use and application of inkjet technologies in an ever-growing number of fields, including electronic component manufacturing processes.
Elephantech Inc. is pleased to announce that, as of September 15, the company has started accepting orders for its Thick Copper Trace P-Flex® utilizing high-speed electroless plating.
Elephantech Inc. manufactures P-Flex®, Flexible Circuits that can be produced with inkjet printing, which significantly reduces environmental burden following our mission of “Making the world sustainable with new manufacturing technologies”.
Elephantech is pleased to announce that, as of May 2021, the company has appointed Mr. Junji Takeo CTO (Chief Technology Officer) and Mr. Gosuke Hashimoto CFO (Chief Financial Officer) as Board Directors.
Elephantech Inc. is pleased to announce that the company has started production of P-Flex® PI utilizing laser ablation and inkjet technologies on May 13th.
This mounted sample circuit board (polyimide substrate) is formed in a pattern that allows the mounting of a 0.5mm Pitch QFP, enabling connections to FPC Connectors and making it suitable for use in a flexible variety of use cases.
Elephantech will promote digital manufacturing with the aim of expanding additive manufacturing through inkjet printing, which is characterized by its digital nature and high degree of freedom in modeling.