Latest posts

Flexible Circuit Board P-Flex® improves the Thermal Response Time of Temperature Sensor ICs and Thermistors
P-Flex® improves the thermal response time of temperature sensors by reducing thermal mass with thin and flexible substrates. Helps conserve energy, reduce power costs, improve human comfort, and detect equipment malfunctions.
【Advantages of Using P-Flex®】Increase the frequency response of MEMS microphones with flexible substrates
MEMS microphones are used in various devices, including smartphones, due to their small size and suitability for mass production. The two advantages of using P-Flex® for MEMS microphones are explained.
[Interview] What is a new sample?
The most significant feature is that this sample uses electrolytic gold plating. What has changed significantly with the adoption of electrolytic gold plating is that the thickness of the gold plating is much thicker than that of electroless gold plating.
Toward a Sustainable Society – Elephantech’s Environmental Information Disclosure Initiatives
Elephantech has worked on visualizing its sustainability efforts change, natural resources, and hazardous substances.
【Press Release】Shinkiba R&D Center begins operations
Elephantech Inc. is pleased to announce that the company has completed the installation of equipment and construction work at its Shinkiba R&D Center. The facility has now started full operation.
【Press Release】Electrolytic Gold-plated Surface P-Flex® PI Samples Now Available
Electrolytic Gold-plated Surface P-Flex® PI Samples Now Available
Elephantech Inc. is pleased to announce that it has begun offering samples of P-Flex® PI with electrolytic gold plating surface treatment.
P-Flex® Flexible Circuits mounted with a QFP
エレファンテック 実装 フレキシブル基板 ポリイミド
This mounted sample circuit board (polyimide substrate) is formed in a pattern that allows the mounting of a 0.5mm Pitch QFP, enabling connections to FPC Connectors and making it suitable for use in a flexible variety of use cases.
The future of electronics:Shifting from “dissolving unnecessary parts” to “printing onto necessary parts”
Shifting from 'dissolving unnecessary parts' to 'printing onto necessary parts' and Contributing to the SDGs’ following goals.