P-Flex🄬 (P-Flex🄬 PI), a polyimide substrate, is a flexible printed circuit board (flexible printed circuit board) based on the Pure Additive® process that we have developed for P-Flex🄬.
P-Flex🄬-PET, a PET substrate developed and marketed by Toshiba, has a low heat resistance temperature (150°C), which limits its application and requires low-temperature soldering for mounting.
P-Flex🄬 PI uses a higher temperature polyimide substrate to provide a more heat-resistant solution for P-Flex🄬 PI. We have solved the problems of FlexTM PET and improved heat and flame resistance. Not only does it offer a wider range of applications, but it also offers a significant improvement in mountability, such as the ability to use conventional solder for mounting components. It can be used in the same way as normal flexible boards.
The most significant feature is that this sample uses electrolytic gold plating. What has changed significantly with the adoption of electrolytic gold plating is that the thickness of the gold plating is much thicker than that of electroless gold plating.
This mounted sample circuit board (polyimide substrate) is formed in a pattern that allows the mounting of a 0.5mm Pitch QFP, enabling connections to FPC Connectors and making it suitable for use in a flexible variety of use cases.