Flex PCB P-Flex®-en Technology Pure Additive processing
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Manufacturing process based on the Pure Additive™ processing（2020/04/08 update）

Manufacturing process based on the Pure Additive™ processing

By producing with the Pure Additive™️ processing, we were able to halven the manufacturing process for flexible substrates as compared to the previous method and speed up production to achieve the shortest ever delivery time.



Please see below for the details.

info.elephantech.co.jp
Overall production technologies: our original Pure Additive Processing
This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit. By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
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Machinery - Automatic Plating Line
The production line measures 10 meters, and a copper layer is formed over the silver ink circuit printed on the circuit board.We added English subtitles for the video.From the videoFrom the rear, the circuit board is subjected of the following procedures: Pre-plating surface preparation, submersion in the plating liquid, and finally rinsing off the plating liquid and treating the surface.Each basket can be equipped with up to 20 sheets, and the total weight including the basket can reach 10kg...