P-Flex® is a single-sided flex PCB manufactured using the Pure Additive™ method.
Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The novel approach to electronic circuit production that Elephantech has developed -- calledPure Additive™ processing -- is based on a totally opposite concept to the conventional method. In this innovative manufacturing method, metallic nano particles are printed only onto the required areas of the board surface, and then electroless plating technology is applied to grow the metal, providing the benefits shown on the below.
|P-Flex Design Guideline v1.2.1||913.1 KB||3月 30, 2020||下载|
|Company Profile||1.2 MB||3月 19, 2020||下载|
|P-Flex_PET Brochure v5.3.1||716.6 KB||3月 19, 2020||下载|
|P-Flex_PI_brochure_v5.3.1||727.1 KB||3月 19, 2020||下载|
|P-Flex_specs_v5.3.1||911.7 KB||3月 13, 2020||下载|
|P-Flex Specifications v5.3.0||1.0 MB||2月 25, 2020||下载|
|P-Flex® for IMPC™ (In-Mold Printed Circuit)||716.5 KB||2月 18, 2020||下载|
|P-Flex Brochure v5.2.1||1.5 MB||2月 5, 2020||下载|
|Electrochemical sensors||434.9 KB||2月 5, 2020||下载|
|Biological electrode||532.3 KB||2月 5, 2020||下载|
|The Capacitive Touch Sensor Electrode||656.0 KB||2月 5, 2020||下载|
|P-Flex Inspection Specifications v1.0.0||134.2 KB||8月 28, 2018||下载|