IMPC™ (In-Mold Printed Circuit) is a type of IME (In-Mold Electronics) technology where an inkjet-printed circuit film is given a three-dimensional form and integrally molded with various plastic resins.
By integrating the resin and the circuitry, the design can be optimized over a wider area, resulting in various advantages such as weight, thickness and cost reductions.
At the IMPC LAB, our aim is to contribute to humanity and society by reinventing manufacturing through the use of next generation IME (In-Mold Electronics) technologies.
The IMPC™ (In-Mold Printed Circuit) solution is a design and manufacturing solution that integrates electronics and resin. It optimizes the entire component, which provides a variety of benefits such as weight reduction, thinning, and cost savings.
IMPC (In-Mold Printed Circuit) is a type of IME technology where an inkjet-printed circuit film is given a three-dimensional form and integrally molded with various plastic resins. Here's an informative video on IMPC.
IMPC™ (In-Mold Printed Circuit) is a kind of IME (In-Mold Electronics) technology in which a printed-circuit film is formed in a three-dimensional shape and integrally molded with resin.
IMPC™ (In-Mold Printed Circuit) is a technology for integral molding to form three-dimensional molded film which electronic circuit was drawn on and resin.