P-Flex® for IMPC™ (In-Mold Printed Circuit)

IMPC™ (In-Mold Printed Circuit)is a technology for integral molding to form three-dimensional molded film which electronic circuit was drawn on and resin.

Our P-Flex makes multi-layerization possible not only for using PET substrate but through the process such as vacuum forming with meander copper wiring. These 3D shaped films use the process of the film of insert molding and such and enable the electronic substrate to integrate into the resin part.

copper wiring

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