P-Flex® is a Flexible Circuits manufactured with Pure Additive™ processing. The Pure Additive™ processing developed by Elephantech combines inkjet printing and electroless copper plating technologies to print metal nanoparticles only where necessary for the circuit formulation before highspeed electroless plating is used to grow the metal and complete the circuit.
P-Flex® improves the thermal response time of temperature sensors by reducing thermal mass with thin and flexible substrates. Helps conserve energy, reduce power costs, improve human comfort, and detect equipment malfunctions.
MEMS microphones are used in various devices, including smartphones, due to their small size and suitability for mass production. The two advantages of using P-Flex® for MEMS microphones are explained.
The most significant feature is that this sample uses electrolytic gold plating. What has changed significantly with the adoption of electrolytic gold plating is that the thickness of the gold plating is much thicker than that of electroless gold plating.
Elephantech Inc. is pleased to announce that the company has completed the installation of equipment and construction work at its Shinkiba R&D Center. The facility has now started full operation.
This mounted sample circuit board (polyimide substrate) is formed in a pattern that allows the mounting of a 0.5mm Pitch QFP, enabling connections to FPC Connectors and making it suitable for use in a flexible variety of use cases.