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Operating our mass-production factory in Tokyo
Highly accurate inkjet-printing of silver nanoparticle ink
Original bath control and surface technology enables 10x faster electroless Cu plating
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P-Flex®
Features of the Flexible Substrate P-Flex®
P-Flex® PI
P-Flex® PET
About Design Data Formats
PCB CAD Tool
IMPC™
IMPC™ Solution
AMC
Additive Manufacturing Center
Ink Discharge Evaluation Service
Print Evaluation
Product Development
Product Development
The capacitive touch sensor electrode
Custom single-sided flexible flat cable
Ag/AgCl electrochemical sensor
Ag/AgCl bioelectrodes
Product Information
Download
Research & Technology
Specifications
P-Flex® - Standard manufacturing specifications
REFERENCE DATA ON THE MINIMUM BENDING RADIUS
REFERENCE DATA ON ANTI-IONIC MIGRATION
ON ROHS AND REACH
ON UL CERTIFICATION
PATTERN PEEL STRENGTH REFERENCE DATA
Manufacturing Engineering
Pure Additive™ process
Manufacturing process
Equipment
Machinery – Automatic Plating Line
Ink Discharge Test : Reproducing the printing process for mass-production
Proprietary Technology
Technology Articles
Operating our mass-production factory in Tokyo
Highly accurate inkjet-printing of silver nanoparticle ink
Original bath control and surface technology enables 10x faster electroless Cu plating
Strong metal-substrate adhesion mechanism
Fully on-demand solder masking and cutting
Corporate Information
About Us
About Elephantech
Company Overview
Management Team
Hatchobori Head office
Press Release
Information
Media
Historical Products
QualityPolicy
Elephantech Quality & Environment Policy
Certification Status
SDGs
SDGs Contribution
Contact
Contact Us
FAQ
Corporate Culture
Message from the CEO
Mission
Elephantech Way - Our 9 cultures
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