エレファンテック株式会社
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Elephantech Inc.
Products & ServicesResearch & TechnologyCorporate InformationPress ReleaseMission

Products & Services

P-Flex®

Features of the Flexible Substrate P-Flex®P-Flex® PIP-Flex® PETAbout Design Data FormatsPCB CAD Tool

IMPC®

IMPC® SolutionIMPC® touch sensor with integrated connectorMulti-Functional IMPC® SampleIMPC® Microwell Plate with Electrochemical Sensor

AMC

Additive Manufacturing CenterInk Discharge Evaluation ServicePrint EvaluationList of Inks for Inkjet

Product Development

Product DevelopmentPEDOT Transparent Touch SensorCustom flexible flat cableAg/AgCl electrochemical sensorAg/AgCl bioelectrodesProduct Information

Case Study

EIZO Corporation. : FlexScan® EV3895 Ultrawide, Curved MonitorFUKUDA Co., Ltd. : Air Leak Test System for Packaging Containers MSQ-2000 series

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Features and Benefits

New Manufacturing with Additive ManufacturingSDGs ContributionOur vision for the future of AM (Additive Manufacturing)

Research & Technology

Specifications

P-Flex® - Standard manufacturing specificationsREFERENCE DATA ON THE MINIMUM BENDING RADIUSREFERENCE DATA ON ANTI-IONIC MIGRATIONON ROHS AND REACHON UL CERTIFICATIONPATTERN PEEL STRENGTH REFERENCE DATA

Manufacturing Engineering

Pure Additive™ ProcessingManufacturing process

Equipment

Machinery – Automatic Plating LineInk Discharge Test : Reproducing the printing process for mass-production

Proprietary Technology

Technology ArticlesOperating our mass-production factory in TokyoHighly accurate inkjet-printing of silver nanoparticle inkOriginal bath control and surface technology enables 10x faster electroless Cu platingStrong metal-substrate adhesion mechanismFully on-demand solder masking and cutting

Corporate Information

About Us

About ElephantechCompany OverviewHistoryRoadmapBoard of DirectorsHatchobori Head officeList of basesPress ReleaseInformationMediaHistorical Products

Information of bases

Operating our mass-production factory in Tokyo (Hatchobori Head office)The large mass-production and research complex for P-Flex®（AMC Nagoya）

QualityPolicy

Elephantech Quality & Environment PolicyScope of the Quality & Environment PolicyCertification Status

SDGs

SDGs Contribution

Contact

Contact UsFAQ

Mission

Message from the CEOMissionElephantech Way - Our 9 cultures
Elephantech Inc.
  • Press Release
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Products & Services

P-Flex®

Features of the Flexible Substrate P-Flex®
P-Flex® PI
P-Flex® PET
About Design Data Formats
PCB CAD Tool

IMPC®

IMPC® Solution

AMC

Additive Manufacturing Center
Ink Discharge Evaluation Service
Print Evaluation

Product Development

Product Development
The capacitive touch sensor electrode
Custom flexible flat cable
Ag/AgCl electrochemical sensor
Ag/AgCl bioelectrodes
Product Information

Case Study

EIZO Corporation’s FlexScan® EV3895 Ultrawide, Curved Monitor

Download

Research & Technology

Specifications

P-Flex® - Standard manufacturing specifications
REFERENCE DATA ON THE MINIMUM BENDING RADIUS
REFERENCE DATA ON ANTI-IONIC MIGRATION
ON ROHS AND REACH
ON UL CERTIFICATION
PATTERN PEEL STRENGTH REFERENCE DATA

Manufacturing Engineering

Pure Additive™ process
Manufacturing process

Equipment

Machinery – Automatic Plating Line
Ink Discharge Test : Reproducing the printing process for mass-production

Proprietary Technology

Technology Articles
Operating our mass-production factory in Tokyo
Highly accurate inkjet-printing of silver nanoparticle ink
Original bath control and surface technology enables 10x faster electroless Cu plating
Strong metal-substrate adhesion mechanism
Fully on-demand solder masking and cutting
Corporate Information

About Us

About Elephantech
Company Overview
Board of Directors
Hatchobori Head office
Press Release
Information
Media
Historical Products

QualityPolicy

Elephantech Quality & Environment Policy
Scope of the Quality & Environment Policy
Certification Status

SDGs

SDGs Contribution

Contact

Contact Us
FAQ
Mission
Message from the CEO
Mission
Elephantech Way - Our 9 cultures
日本語 English 简体中文
Contact
TOP Technology Uniqueness of our Technology

Uniqueness of our Technology

Overall production technologies: our original pure additive process

Overall production technologies: our original pure additive process
Operating our mass-production factory in Tokyo

Operating our mass-production factory in Tokyo
Highly accurate inkjet-printing of silver nanoparticle ink

Highly accurate inkjet-printing of silver nanoparticle ink
Original bath control and surface technology enables 10x faster electroless Cu plating

Original bath control and surface technology enables 10x faster electroless Cu plating
Strong metal-substrate adhesion mechanism

Strong metal-substrate adhesion mechanism
Fully on-demand solder masking and cutting

Fully on-demand solder masking and cutting
page top

Products & Services

P-Flex ®
IMPC®（In-Mold Printed Circuit）
AMC（Additive Manufacturing Center）

Research & Technology

P-Flex ® - Standard manufacturing specifications
pure additive™ processing
Manufacturing process
Uniqueness of our Technology
P-Flex ® Quality Test

Corporate Information

Company Overview
Contact
Hatchobori Head office
AMC Nagoya
Press Release
Sitemap

Mission

Message from the CEO
Mission
Elephantech Way

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Elephantech Inc.
4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan ( Map )

www.elephantech.co.jp/en
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© 2014- Elephantech Inc.